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タイトル: Novel technique for formation of metal lines by functional liquid containing metal nanoparticles and reduction of their resistivity by hydrogen treatment
著者: Nguyen, Thi Thanh Kieu
Ohdaira, Keisuke
Shimoda, Tatsuya
Matsumura, Hideki
キーワード: Cat-CVD
Functional liquid
発行日: 2010-07-07
出版者: American Vacuum Society
誌名: Journal of Vacuum Science and Technology B
巻: 28
号: 4
開始ページ: 775
終了ページ: 782
DOI: 10.1116/1.3456179
抄録: A novel technique for formation of metal lines for electronic devices, and for reduction of resistivity in such metal lines, is proposed. In the technique, the metal lines are formed in trenches by using functional liquids containing metal nanoparticles. The trenches are constructed on a plastic substrate by imprint of a patterned mold. When the whole surface of the plastic substrate is covered with a hydrophobic film, the hydrophobic property disappears only in the trenches due to the pressing process of the imprint, and thus the functional liquid automatically accumulates into the trenches. When the metallic functional liquid is modified with tween-20 (polyoxyethylene-20), metal lines with a width of 10 μm are formed by capillary effect. The resistivity of such metal lines can be lowered to the order of 10^<−6> Ω cm by exposing them to hydrogen atoms generated in vacuum by catalytic cracking of hydrogen molecules with heated tungsten wires.
Rights: Copyright 2010 American Vacuum Society. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Vacuum Society. The following article appeared in Nguyen Thi Thanh Kieu, Keisuke Ohdaira, Tatsuya Shimoda, and Hideki Matsumura, Journal of Vacuum Science and Technology B, 28(4), 775-782 (2010) and may be found at http://dx.doi.org/10.1116/1.3456179
URI: http://hdl.handle.net/10119/9525
資料タイプ: publisher
出現コレクション:c10-1. 雑誌掲載論文 (Journal Articles)

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